All photos, specifications, contents are used for reference only and are subject to change without notice. Actual products in different countries varies and are best to consult your local distributor / importer for confirmation.
Solventless Formulation
Flowable
Non Curing - No need for curing ovens
Capable of achieving thin Bond Line Thickness for optimum performance
Very Low Thermal Resistance
High Thermal Conductivity
Conducts heat away from sensitive components
All photos, specifications, contents are used for reference only and are subject to change without notice. Actual products in different countries varies and are best to consult your local distributor / importer for confirmation.